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UPILEX®-NVFの特徴

2025年11月12日

PI film for laminated type CCL

Features of UPILEX

  • High-strength, tear-resistant tough film
  • High heat resistance and dimensional stability, with excellent workability

Comparison Chart with Other TPI Films

★☆☆: Standard、 ★★☆ : Good、 ★★★ : Excellent 、 -: Not yet rated

Film properties

Item Unit 25NVF 50NVF 75NVF LCP 50NVT Reference Method
/Condition
Thickness (Nominal) μm 25 50 75 50 50
Electrical Dielectric constant 10GHz 3.5 3.5 3.5 3.4 3.6 Split-Cylinder
Resonator Method
25℃, 50%RH
Dissipation factor 0.005 0.005 0.005 0.002 0.009
Transmission loss 6GHz dB/100mm -3.1 -1.8 -1.4 -1.5 -2.0 Microstripline
25℃, 50%RH
10GHz -4.2 -2.5 -1.9 -2.1 -2.9
Mechanical Tensile strength MPa 540 600 530 230 500 ASTM D882
Elongation % 80 75 75 50 80 ASTM D882
Tensile modulus GPa 7.3 8.1 7.8 3 7.7 ASTM D882
Tear strength / trouser N / mm 3.3 5.0 6.4 5.3 4.9 JIS K 7128-1
MIT Cycle >100,000 >100,000 41,000 >100,000 29,000 ASTM D2176
R=0.38mm,9.8N
CTE (MD) ppm/℃ 19 19 20 18 19 TMA
50-200℃
Tg (Tm) 270 270 270 (335) 280 DMA (DSC)
Moisture absorption % 1.0 1.1 1.2 ≦ 0.1 0.8 25℃, 50%RH
Light transmittance / 600nm % 73 55 42 ≒0 64 JIS K 7136
Haze % 5 8 10 ≒100 6 JIS K 7136

UBE measured value and catalog data.
These data are measured values, not guaranteed values.

Transmission loss

75NVF is lower transmission loss than LCP and can be available in the wide range to high frequency

Item Unit 25NVF 50NVF 75NVF LCP
Thickness μm 25 50 75 50
Transmission loss 10GHz dB / 100mm -4.2 -2.5 -1.9 -2.1
Power rate % 38 56 64 62

Transmission loss = 10 log10 (output power / input power)
Power rate = (output power / input power)×100

These data are measured values, not guaranteed values.

Mechanical properties

UPILEX®-NVF has superior mechanical properties compared to LCP

Tensile property

These data are measured values, not guaranteed values.

Dimensional stability

The Dimensional Change of UPILEX®- NVF is within 0.05% after High Temp Treatment

Conditions of CCL production

Method : Roll Laminate, Laminate temperature : 350℃, Copper foil : Rolled copper foil

These data are measured values, not guaranteed values.

Solder heat resistance

Sample Solder heat resistance
TPI SIDE Test Temperature [℃] Heat resistance
temperature [℃]
Grade 290 300 310 320 330
25NVT A × 320 320
B 330
50NVT A × × 310 300
B × × × 300
25NVF A 330 330
B 330
50NVF A 330 330
B 330
75NVF A 330 320
B × 320

Peel Strength

The Peel Strength of UPILEX®-NVF is ≧ 1.0N/mm

Conditions of CCL production

Method : Roll Laminate, Laminate temperature : 360℃, Copper foil :Rolled copper foil / Electrolytic copper foil

These data are measured values, not guaranteed values.