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Strengths

Heat-resistant and functional Polyimide film derived from BPDA

In addition to the excellent properties of general polyimide resins (heat resistance, high mechanical properties and excellent electrical insulating properties), UBE's polyimide film "UPILEX®" has various advantages unique to our formulation.

  • High heat resistance
    UPILEX S can be used in high-temperature processes just below 500°C.
  • High mechanical properties
    Upilex has excellent wear resistance and toughness.
    This allows use of thinner films in applications where strength is critical.
  • Chemical resistance
    It has excellent chemical resistance to organic solvents, gasoline,automotive oil, alkalis, acids etc..
  • High-performance technology
    The industry leading surface uniformity and smoothness of Upilex improves performance and adds value to your application.

Grade lineup

UBE developed advanced film grades by customizing the base technology of the polyimide film surface, while maintaining the many advantages of the existing grade "UPILEX®-S".
"UPILEX®" is used globally by many customers, who all demand the exceptional performance we deliver. Click below for detailed data for each grade

  • Mechanical properties：
    High tensile strength and modulus. Demonstrates outstanding mechanical characteristics through a wide temperature range.
  • Electrical properties：
    Excellent electrical characteristics over a wide range of temperatures and frequencies.
  • Thermal properties：
    Outstanding heat resistance. Excellent heat shrinkage and dimensional stability.
  • Environmental resistance：
    Low water absorption and hygroscopic expansion.
  • Chemical resistance：
    Insoluble in all organic solvents and resistant to chemicals (acids and alkalis etc.).
  • Smooth surface：
    Excellent surface smoothness allows fine pitch patterning.

  • Molding processability：
    Elongation over 100%.Excellent moldability for embossing due to better flexibility and lower modulus than "UPILEX®-S".
  • Environmental resistance：
    Molded articles have excellent heat resistance and chemical resistance, so they are used in insulation applications and in applications requiring environmental resistance.

Enhanced thermal adhesion to metal

As base films for laminated multilayer FPC and two-layer CCL, they have superior heat bonding characteristics and physical properties.

Enhanced adhesion of resin surface

It is suitable for sputtering or plating process and has superior mechanical properties. Dimensional stability and chemical resistance are equal to "UPILEX®-S".

Please see below for other UBE Polyimide Products.

Applications

UBE offers various grades of "UPILEX®" for use in a wide variety of applications.

●Various materials used in circuit boards
・Base film
・cover film
・Reinforcing plate

●Flexible display base

●Thin devices
・TFT
・Nano-ink
・Various thin films

● The base material for adhesive films
●Carrier film for curable resin systems
●Release film for heat press applications

●Speaker cone
●Embossing products
●Reflector
●Shield material
●Insulating member

●Film based wire harness
●Thermal resistant insulating film for heaters
●Protective film for metal moldings
●The base substrate of circuit board
●Interlayer insulating film in multilayer substrate

●Laminated two-layer CCL

●Heat bonding film between the structural member