Water Solvent Polyimide
Overview
-
NMP-free
Water-based varnish -
Approximately
80% reduction
in NMP solvent content -
Environmentally friendly and
improved
workplace safety -
Uses BPDA,manufactured
in-house by UBE,
as a raw material -
Capable of low-temperature
thermal processing:
from 150℃ -
Refrigerated storage
recommended
Features
-
Development Product 1
Parameter
- Solvent
- Water
- Glass Transition
Temperature (Tg) - 145℃
- Elongation at Break
- 199%
- Tensile Elasticity
- 1.9GPa
- Tensile Strength at Break
- 106MPa
- Insulation Breakdown
Voltage - 5.5kV/mm
Features
- ・Imidization proceeds well at 150℃.
- ・Excellent elongation; more flexible compared to conventional polyimides.
-
Development Product 2
Parameter
- Solvent
- Water
- Glass Transition
Temperature (Tg) - 210℃
- Elongation at Break
- 164%
- Tensile Elasticity
- 3.2GPa
- Tensile Strength at Break
- 214MPa
- Insulation Breakdown
Voltage - 6.3kV/mm
Features
- ・Possesses intermediate properties between Development Products 1 and 2.
-
Development Product 3
Parameter
- Solvent
- Water
- Glass Transition
Temperature (Tg) - 339℃
- Elongation at Break
- 96%
- Tensile Elasticity
- 4.6GPa
- Tensile Strength at Break
- 289MPa
- Insulation Breakdown
Voltage - 6.5kV/mm
Features
- ・High heat resistance and high tensile elasticity composition. Exhibits properties comparable to conventional polyimides.
Applications
-
Insulation Coating
-
Binder
-
Substrate
-
Heat-Resistant Coating
-
Dispersant
Information
| Type | Unit | U-Varnish-S | U-Varnish-A | Development1 | Development2 | Development3 | Test Condition Test method |
|
|---|---|---|---|---|---|---|---|---|
| Film thickness | um | 20 | 20 | 20 | 20 | 20 | ||
| Maximum heat treament temperature |
℃ | 450 | 350 | 150 | 250 | 350 | ||
| solvent | ー | NMP | NMP | Water | Water | Water | ||
| Solid Content | wt% | 18.0±1.0 | 18.0±1.0 | 18 | 11 | 18 | 350℃, 30min | |
| viscosity | Pa・ｓ | 5±1 | 5±1 | 3.5 | 2.5 | 4 | 30℃ | |
| Density | 103kg/m3 | 1.10~1.11 | 1.10~1.11 | ー | ー | 1.10 | 25℃ | |
| Strage condition | ℃ | ＜30℃ | ＜30℃ | ＜30℃ | ＜30℃ | ＜30℃ | ||
| Film properties |
glass transition temperature Tg |
℃ | 322 | 274 | 145 | 210 | 339 | Dynamic viscoelasticity |
| Tensile Strength | MPa | 526 | 229 | 106 | 214 | 289 | ASTM D882 | |
| Elongati on | % | 35 | 92 | 199 | 164 | 96 | ASTM D882 | |
| Tensile Elasticity |
GPa | 9.8 | 3.7 | 1.9 | 3.2 | 4.6 | ASTM D882 | |
| 5% Heat Weight Reduction Temperature |
℃ | 619 | 592 | ー | ー | 574 | TGA | |
| Insulation Breakdown Voltage |
kV | 7.0 | 7.7 | 5.5 | 6.3 | 6.5 | ASTM D149 | |
