UPIA-NF Series
Overview
NMP (1-methyl-2-pyrrolidone) is commonly used as a solvent for polyimide resin, a substance used in a wide range of industries including organic synthesis, semiconductors, and batteries. However, there are health risks associated with NMPs, including skin irritation and respiratory effects from inhalation of vapors. UBE is working on the development of water-soluble polyimide varnishes that do not use NMP as a solvent from both health and environmental perspectives.
Features
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1.Strength equivalent to or greater than U Varnish A
Water-soluble polyimide varnish with strength equal to or greater than U-varnish A
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2.Low temperature curing is possible
Polyimide varnish capable of low temperature curing
Information
Type | Unit | U-Varnish-S | U-Varnish-A | Development1 | Development2 | Test Condition Test method |
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Film thickness | um | 20 | 20 | 20 | 20 | 20 | 10 | ||
Maximum heat treament temperature | ℃ | 200 | 450 | 200 | 350 | 350 | 150 | ||
solvent | ー | NMP | NMP | Water | Water | ||||
Solid Content | wt% | 18.0±1.0 | 18.0±1.0 | 18 | 18 | 350℃, 30min | |||
viscosity | Pa's | 5±1 | 5±1 | 3.5 | 3.5 | 30℃ | |||
Density | 103kg/m3 | 1.10~1.11 | 1.10~1.11 | 1.10 | ー | 25℃ | |||
Strage condition | ℃ | <30℃ | <30℃ | <30℃ | <30℃ | ||||
Film properties | Tg | ℃ | 267 | 322 | 243 | 274 | 339 | 145 | Dynamic viscoelasticity |
Tensile Strength | MPa | 235 | 526 | 175 | 229 | 289 | 106 | ASTM D882 | |
Elongation | % | 23 | 35 | 70 | 92 | 96 | 199 | ASTM D882 | |
Tensile Elasticity | GPa | 7.5 | 9.8 | 3.2 | 3.7 | 4.6 | 1.9 | ASTM D882 | |
5% Heat Weight Reduction Temperature | ℃ | 514 | 619 | 546 | 592 | 574 | ー | TGA | |
Insulation Breakdown Voltage | KV | 6.5 | 7.0 | 7.2 | 7.7 | ー | ー | ASTM D882 |