Overview

NMP (1-methyl-2-pyrrolidone) is commonly used as a solvent for polyimide resin, a substance used in a wide range of industries including organic synthesis, semiconductors, and batteries. However, there are health risks associated with NMPs, including skin irritation and respiratory effects from inhalation of vapors. UBE is working on the development of water-soluble polyimide varnishes that do not use NMP as a solvent from both health and environmental perspectives.

Features

  1. 1.Strength equivalent to or greater than U Varnish A

    Water-soluble polyimide varnish with strength equal to or greater than U-varnish A

  2. 2.Low temperature curing is possible

    Polyimide varnish capable of low temperature curing

Information

Type Unit U-Varnish-S U-Varnish-A Development1 Development2 Test Condition
Test method
Film thickness um 20 20 20 20 20 10
Maximum heat treament temperature 200 450 200 350 350 150
solvent NMP NMP Water Water  
Solid Content wt% 18.0±1.0 18.0±1.0 18 18 350℃, 30min
viscosity Pa's 5±1 5±1 3.5 3.5 30℃
Density 103kg/m3 1.10~1.11 1.10~1.11 1.10 25℃
Strage condition <30℃ <30℃ <30℃ <30℃  
Film properties Tg 267 322 243 274 339 145 Dynamic viscoelasticity
Tensile Strength MPa 235 526 175 229 289 106 ASTM D882
Elongation % 23 35 70 92 96 199 ASTM D882
Tensile Elasticity GPa 7.5 9.8 3.2 3.7 4.6 1.9 ASTM D882
5% Heat Weight Reduction Temperature 514 619 546 592 574 TGA
Insulation Breakdown Voltage KV 6.5 7.0 7.2 7.7 ASTM D882