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Polyimide base Copper clad laminate

Upisel®-N

Upisel®-N is a non-adhesive-type flexible copper clad laminate that is based on our Upilex®-VT polyimide film. The base layer of Upilex®-VT is the same type of BPDA polyimide as our Upilex®-S, which delivers excellent dimensional stability and heat resistance.

* Upisel is a registered trademark in Japan and other countries of sale.
* Upilex is a registered trademark in Japan and other countries of sale.

Structures

  • Double-sided type
  • Single-sided type

Characteristics

  • Delivers high reliability due to its non-adhesiveness, because there is no degradation of physical properties like that which arises in the adhesive layer of adhesive materials.
  • Features excellent peeling strength, heat soldering resistance, chemical resistance, and dimensional stability.
  • The polyimide layer of the one-sided type can be thermally bonded with other metals, ceramics, and similar materials.
  • Environmentally friendly because no adhesives are used.

Uses/Fields

FPC, TCP, MCM-L, COF, rigid-flex boards, multi-layer boards, metal-based boards, high-frequency boards, heat-resistant boards, IC cards, boards for automobiles, and electromagnetic wave shield material.

Properties

Test item Test condition Unit Measured value*1 Test method
Peel strength Normal N/mm 1.5 JIS C6471
Method A
After heat test 150°C 1,000 hrs. 1.5
After moist heat test 85°C/85%RH
for 1,000 hrs.
1.5
After chemical resistance test 2N-HCl, 23°C,
5 min.
1.5
2N-NaOH, 23°C,
5 min.
1.5
Dimensional stability After CU etching MD % 0.00 IPC-TM-650 2.2.4 Method B
TD 0.03
After heating to 150°C for 30 min. MD -0.02 IPC-TM-650 2.2.4 Method C
TD 0.02
Solder heat resistance 300°C, 1 min.   No abnormalities JIS C6471
Non-flammability V-0 UL94
Volume resistivity Ω·cm 4×1016 ASTM D257
Surface resistivity Ω 1×1017
Dielectric constant 1kHz   3.2 ASTM D150
Dissipation factor 1kHz   0.004
Breakdown voltage kV 6.9 ASTM D149
Water absorption % 1.1 IPC-TM-650 2.6.2
Tensile modulus GPa 7.2 ASTM D882
Tensile strength MPa 519 IPC-TM-650 2.4.19
Elongation % 106
MIT folding endurance Times >100,000 ASTM D2176
*1
These are typical values for BE1210 (Polyimide film: 25µm, Electrolytic copper foil: 18 µm, two-sided board).
 

Grades

Copper foil thickness
  • Electrolytic copper foil (9, 12, 18 μm)
  • Rolled copper foil (12, 18 μm)
Insulation layer (polyimide) thickness 15, 20, 25, 50 μm
Standard width 250 mm, 500 mm

Please contact us if you require other specifications or sizes.


Products Inquiry UBE EXSYMO CO., LTD.
Electronic Materials Sales Group
Phone : +81(3)6667-2419   Fax : +81(3)6667-2435

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